Welcome: Shenzhen Angxun Technology Co., Ltd.
tom@angxunmb.com 86 18933248858

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From “Vendor vs. Client” to “Co-Founders”: How We Co-Create Winning Products With Global Brands

In today’s hyper-competitive hardware market, the old “Party A vs. Party B” relationship is no longer enough to build great products. Real innovation now requires something deeper: engineering teams working as one, sharing responsibility, and co-creating solutions from day one.

 

At Shenzhen Angxun Technology Co., Ltd., we have spent the last 24 years evolving from a traditional OEM/ODM factory into a true engineering partner for global brands. Since our founding in 2003, we’ve grown into a high-tech enterprise with:

  • 10,000 m² modern manufacturing campus

  • 500+ skilled employees and full-stack engineering talent

  • 5 advanced SMT lines, high-precision SPI/AOI systems

  • Monthly capacity of 300,000+ motherboards

  • A complete R&D portfolio spanning Intel/AMD motherboards, industrial boards, Mini PCs, laptops, and graphics cards

 

But scale alone isn’t what makes co-creation successful.

It’s the way we embed our engineers into our customers’ teams.

 

A Real Case Study: When Two Teams Become One

One of our recent success stories started like many others — a brand approached us with a concept for a high-performance, thermally stable motherboard for its next-generation workstation lineup.

Instead of waiting for complete specifications, we sent our senior engineers directly into their concept review workflow. For three months, our teams operated as if we were one company:

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1. Joint Definition of Product Goals

We aligned early on thermal targets, BIOS behavior, VRM requirements, PCB routing constraints, memory vendor compatibility, and long-cycle component strategies.

 

2. Co-Design and Rapid Iteration

With over 50+ in-house R&D designers, Angxun engineers co-developed:

  • A well-optimized aluminum-base cooling system

  • All-solid capacitors for long-life stability

  • Copper-plated PCB layers for lower impedance and cleaner power delivery

  • Independent CPU power architecture to support high-load scenarios

  • Zero-burn protection circuitry

  • Dual safety voltage-stabilization modules for uniform load distribution

Every revision was jointly reviewed, tested, and validated — not “vendor submitting samples,” but engineering teams solving the same problems together.

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3. Early Compatibility Stress Testing

Our test lab conducted accelerated aging, memory/HDD/NVMe vendor matrix validation, and extreme thermal cycling, while the customer’s team provided workload-specific testing profiles.

This drastically reduced late-stage integration risks.

 

4. From Prototype to Mass Production – Seamlessly

Because Angxun controls:

  • SMT

  • DIP

  • Reliability testing

  • Assembly

  • Firmware

  • Supply chain

  • Final QA

…the customer moved from prototype approval to stable mass production 40% faster than their previous suppliers.

The final product reached the market ahead of competitors — with fewer field failures, lower RMA rates, and significantly higher customer satisfaction.

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Why Co-Creation Works at Angxun

✔ 24 Years of OEM/ODM Experience

We understand brand workflows, not just manufacturing processes.

✔ Strong Engineering Infrastructure

Our 50+ R&D team covers electrical design, firmware/BIOS development, thermal engineering, mechanical design, and DFM/DFT optimization.

✔ Certified Quality & Responsible Production

CE, RoHS, FCC, and ISO-certified manufacturing, with eco-friendly materials used throughout production.

✔ Large-Scale Manufacturing With Rapid Delivery

With 300,000+ pcs monthly motherboard capacity, we support fast launches without sacrificing quality.

✔ Guaranteed After-Sales Support

Our commitment doesn’t end at shipment — engineering assistance, compatibility updates, and continuous improvement are standard parts of our cooperation.

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From Supplier to Strategic Partner

When a customer trusts our engineers enough to let us participate in concept reviews, mechanical ID discussions, and early architecture decisions, the relationship transforms.

We’re no longer “Party A/Party B

We become co-founders of the product’s success.

That’s the future of hardware manufacturing — and what global brands increasingly expect from their partners.

 

If Your Next Product Requires a Trusted Co-Creation Partner

We would be glad to collaborate from concept to mass production.

Shenzhen Angxun Technology Co., Ltd.

Your engineering-driven OEM/ODM partner for Intel/AMD motherboards, industrial PCs, Mini PCs, laptops, and more.

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CONTACT US

Contact: Tom

Phone: 86 18933248858

E-mail: tom@angxunmb.com

Whatsapp:86 18933248858

Add: Floor 301 401 501, Building 3, Huaguan Industrial Park,No.63, Zhangqi Road, Guixiang Community, Guanlan Street,Longhua District,Shenzhen,Guangdong,China