China's semiconductor industry mergers and acquisitions accelerate domestic substitution

In 2025, China's semiconductor industry ushered in a wave of mergers and acquisitions, with 48 restructuring cases in the first quarter alone, covering the entire chain of equipment, materials, and design:

1.Platform layout of leading enterprises:

a.North Huachuang holds a 17.9% stake in Xinyuanwei, making up for the shortcomings of coating and developing equipment, forming a full-chain capability of "etching + thin film deposition + cleaning", and the equipment has entered SMIC's 28nm production line.

b.Huahai Qingke acquired Xinyu Semiconductor, extending its business from CMP to ion implantation. Its thinning and polishing all-in-one machine is compatible with HBM memory chip packaging, and its technical indicators are comparable to those of applied materials.

2.Technological breakthroughs of emerging enterprises:

a.Xinkailai released 31 equipment at the SEMICON China 2025 exhibition, covering the entire process of etching, thin film deposition and measurement and testing. 90% of core components are localized, and some products have entered the Yangtze River Storage verification stage.

b.The third generation of core launched 8-inch silicon carbide epitaxial equipment, which reduces the defect rate by 30% through multi-zone air intake technology, supporting the mass production of new energy vehicle electronic control chips.

3.Policy and market dual drive:

a.The third phase of the National Big Fund focuses on supporting the localization of equipment and materials. In 2025, R&D investment will increase by 23% year-on-year, and the localization rate of storage chip equipment will increase to 25%.

b.The Sino-US trade war has forced the internal circulation of the industrial chain. The yield rate of domestic 28nm production lines has reached 90%, and the cost is 30% lower than that of overseas, accelerating substitution in the fields of automotive electronics and industrial control.

If possible, take a look at Angthumb B450M-A ,AMD Ryzen AM4 Series Processor ,Gigabit,LAN,DDR4, HDMI,VGA,DVI, M.2, WIFI,M-ATX，ATX Input,the following parameters are supported：

▲ Support AMD Ryzen AM4 Series Processors

▲Supports 1 M.2(NVME protocol and SATA protocol)

▲Supports four SATA ports

▲Support high-speed DDR4 dual channel memory Support

2400/2666/2933/3200 maximum capacity 64G

▲Supports 6 USB3.2; 6 USB2.0

▲RJ45 Gigabit network adapter port

▲1*WIFI

▲Support 6-phase power supply, 4-layer PCB